The NE-OIC04 inline plasma cleaner integrates automated loading/unloading mechanisms, precision transfer systems, and modular vacuum chambers to deliver a complete surface treatment solution. Specifically designed for IC packaging preparation, it performs critical pre-cleaning before die attachment, wire bonding, and encapsulation processes, substantially improving interfacial adhesion and process reliability to maximize overall packaging yield.

Limitations of Conventional Batch Systems

Traditional chamber-type batch plasma cleaners operate with limited automation and throughput. Their typical four-sided cartridge design—where substrates are vertically stacked with narrow interlayer spacing—often creates shadowing effects from sidewalls or insufficient inter-substrate clearance (e.g., gaps <5 mm). These structural limitations lead to uneven plasma distribution, leaving areas untreated and compromising process consistency.

Advanced Inline Processing Methodology

The NE-OIC04 resolves these issues through an integrated automation approach:

1. Individualized Handling: A robotic arm extracts lead frames one by one from the cartridge and positions them on a flat carrier platform.

2. Unobstructed Plasma Exposure: Inside the cleaning chamber, lead frames are treated without front, top, or bottom obstructions, enabling full-surface plasma immersion.

3. Automated Reloading: A synchronized unloading mechanism returns processed frames to the cartridge, ensuring scratch-free handling and positional integrity.

This single-piece flow methodology eliminates shadowing effects and ensures complete, uniform plasma exposure across all substrate surfaces, delivering superior consistency and cleaning performance compared to conventional batch systems.