ICP Vertical Plasma Asher is mainly used for processes such as wafer stripping or mask removal. ICP Vertical Plasma Asher treatment system features of a larger circular aluminium vacuum chamber that is 250mm in diameter and with a direct powered RF electrode for processing.

When fitted with a high power RF source (13.56 MHz), the NE-Q15H is a popular choice for use as a plasma asher. Although all of our systems are versatile and can perform many tasks without changing configuration settings, the NE-Q15H is the best value in the industry for plasma ashing; the process of removing photoresist from an etched wafer. When fitted with a lower power RF source, the system also excels at plasma cleaning and surface modification applications.

NE-Q15H is widely used in scientific research institutions, enterprise R&D units and small batch production proofing,including:

• Plasma cleaning organics

• Plasma surface activation to improve adhesion

• PDMS & microfluidic devices

• PEEK & other engineering polymers

• PTFE

• Metals

• Ceramics

• Glass & optical devices