RIE Plasma Asher is a dry - type plasma photoresist stripping device, suitable for the photoresist removal and ashing processes of wafers with a diameter of 8 inches or less. NE-RE08 employs a high - density RIE plasma etching system and offers performance advantages such as a fast photoresist stripping rate, good uniformity, high selectivity ratio, and excellent anisotropy.

Applications:

• Strip positive/negative photoresists on 8 - inch or smaller wafers (SOI, Si, glass, copper, etc.)

• Strip polyimide (PI) photoresist

• Remove organic substances

• PR Descum primer process post - lithography

• Plasma - activate substrate surface (O₂/Ar)

Features:

• RIE mode for fast resist stripping

• Full - area gas showerhead and radial exhaust for high uniformity and speed

• Water - cooled electrode controls substrate temperature

• Pneumatic lid for easy wafer handling