NE-PE13F is a cost-effective dry adhesive removal desktop plasma asher that can be used for surface activation and cleaning of samples with a size of 8 inches or less. The working principle of plasma asher is to place epitaxial wafers/wafers coated with photoresist in a vacuum reaction system, introduce a small amount of oxygen, and use voltage discharge to ionize oxygen (O2) into excited oxygen atoms (O). Then, the oxygen atoms react rapidly with C and H in the resist to generate volatile gases such as CO, CO2, and H2O, which are pumped away by a vacuum pump to achieve the purpose of ashing. Plasma ashing is not only simple to operate, but also has high ahsing efficiency. After ashing, the wafer surface is clean and smooth without scratches, with low cost and environmental protection, which is conducive to ensuring product quality.