RF Plasma Asher Machine is a vacuum plasma system specially designed for processing wafers and silicon wafers for degumming, cleaning and activation. Plasma treatment is the process of removing the photoresist by burning off the organics. Using a processing tool, monatomic plasma is created by exposing oxygen or fluorine gas at low pressure to high-power radio waves, which ionise it. This process is performed under vacuum to create a plasma that turns the photoresist to ash.

RF Plasma Asher Machine is suitable for various substrates such as glass, metal seed layer, silicon wafer, piezoelectric ceramics, etc. Plasma bombardment can not only remove the residual glue on the surface, but also activate the substrate and improve its surface hydrophilicity.

NE-PE13FH is widely used in scientific research institutions, enterprise R&D units and small batch production proofing, including:

• Plasma cleaning organics

• Plasma surface activation to improve adhesion

• Wafer Cleaning

• Descum for WLP

• Stripping & Etch for WLP

• Wafer Pre-Treatment

• BCB & UBM Adhesion

• Dielectric Patterning

• Via Cleaning for WLP