This advanced plasma system delivers precision surface treatment across entire components, localized regions, and complex geometries—supporting cleaning, activation, modification, and etching processes. It stands out for its exceptional versatility in uniformly treating a broad spectrum of materials—from plastics, glass, and ceramics to metals—regardless of shape or structural complexity. Through plasma surface engineering, key material properties such as hydrophilicity, wettability, adhesion, and dye affinity are significantly improved.

Equipped with dual integrated electrodes, the system generates a controlled electric field inside the processing chamber. A vacuum pump establishes a low-pressure environment, where gas molecules become increasingly sparse as vacuum deepens. This extended molecular mean free path, combined with electric field acceleration, promotes collisions that ionize the gas and sustain a stable, uniform plasma.

Surface Modification Mechanisms

1. Plasma exposure induces four fundamental physicochemical transformations on material surfaces.

2. Radical Formation: High-energy species cleave molecular bonds, generating reactive free radicals that boost surface chemical activity.

3. Micro-Etching: Surfaces develop nanoscale roughness, enhancing surface area and altering morphology for improved mechanical interlocking.

4. Cross-Linking: Surface radicals recombine into a dense, interconnected network, strengthening the near-surface region.

5. Polar Group Grafting: Radical-rich surfaces react with plasma species, introducing polar functional groups that enhance chemical reactivity and compatibility.