NE-Q03H ICP Plasma Treater
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DESCRIPTION

ICP Plasma Treater is a high-precision device specifically designed for surface cleaning and modification. Its core principle is to efficiently remove organic or inorganic pollutants from the surface of objects using plasma technology, and optimize the surface properties of materials. This device introduces process gases (usually hydrogen, oxygen, helium, etc.) to excite gas molecules under the action of a high-energy electric field, causing them to ionize and form plasma. These plasmas are composed of high-energy electrons, ions, free radicals, and excited molecules, and have extremely high chemical activity. Under the action of an electric field, active particles in the plasma collide with the surface of the object to be cleaned at high speed, and through physical bombardment or chemical reactions with pollutant molecules, decompose them into volatile small molecules or directly peel them off, thereby achieving deep surface cleaning. In addition to its cleaning function, the plasma cleaner can also change the physical and chemical properties of the material surface to a certain extent. For example, by selecting different working gases and processing parameters, specific functional groups can be introduced on the surface of materials to enhance their wettability, adhesion, or biocompatibility. This surface modification function has wide application value in fields such as microelectronics manufacturing, optical devices, biomedical materials, etc.

Product features of NE-Q03H plasma cleaning treater: 1. Automatic door opening and closing design, realizing the automatic opening and closing of the equipment vacuum door, reducing the manual operation of operators, and ensuring the sealing effect of the vacuum door; 2. 7-inch color touch screen interactive operation interface, displaying real-time working parameter status intuitively; 3. Using a quality flow meter to control the process gas flow rate for more accurate control; 4. Supports switching between manual/automatic working modes, can store multiple process formulas for easy retrieval, and has traceable process data; 5. Adopting a 45 degree tilt angle operation panel design, it conforms to ergonomics, is easy to operate, and has a friendly interface.

PARAMETER

ModelNE-Q03H
Plasma generate frequency13.56MHz
Plasma generate power300W(solid state RF power)
Chamber material
Quartz
Chamber size
Φ105×300(D)mm
Gas flow controller0-300 SCCM)(MFC)
Chamber volume
2.5L
Process gas2 channels(oxygen, argon, etc)
Control modePLC+7'' touch screen
Dimensions552mm(L)×612mm(W) ×520 mm(H)
Power supply220V


PRODUCT FEATURES

01

Fast Deposition Rate

Fast Deposition Rate

02

Good Film Quality

Good Film Quality

03

Process Stability

Process Stability

04

High Productivity

High Productivity

05

Fully Automatic

Fully Automatic

06

Simple Operation

Simple Operation

INDUSTRY APPLICATION

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