DESCRIPTION
Oxygen Plasma Treatment
Oxygen Plasma Cleaner is suitable for small-scale production and scientific experiments. Oxygen plasma at low pressure (high vacuum) reacts with the molecules deposited on the surface of the piece being worked on, it breaks them up and converts them into volatile compounds.
NE-0P20F is particularly effective for eliminating organic compounds, such as grease, oil and polymers, from the surface. It is also a strong disinfectant. It can also be used for etching processes and activating OH groups on rusty surfaces, changing the hydrophilic properties.
Bioeconomy, Biotechnology and Food Systems
Industry, Materials and Circular Economy
Science For Engineering and Architecture
Social Innovation, Open Science, Governance, and Education Science
The NE-OP20F Oxygen Plasma Cleaner is a compact, low-pressure plasma system designed for ultra-fine surface treatment, organic contaminant removal, and surface activation using high-purity oxygen. It offers a clean, dry alternative to traditional chemical cleaning methods, suitable for semiconductor, optics, and biomedical applications.
Semiconductor wafer cleaning and photoresist removal
Surface activation for polymer bonding
Glass and optical lens cleaning without scratching
Biomedical device preparation and sterilization
Low-temperature and solvent-free processing
Uniform plasma distribution for consistent results
Programmable control for repeatable performance
Ideal for sensitive materials and fine structures
Sample is loaded into the vacuum chamber
Chamber is evacuated to ≤100 Pa
Oxygen gas is introduced and ignited with 13.56 MHz RF power
Plasma reacts with surface organics, converting them into CO₂ and H₂O
System vents, and the cleaned sample is removed
Chamber size: 200 × 200 × 120 mm
RF Power: 0–200 W
Vacuum level: ≤100 Pa
Supported gases: O₂, Ar, N₂
Control interface: Touchscreen programmable
PARAMETER
| Enclosure | Dimensions | 650mm(L)×575mm(W) ×635 mm(H) |
| Weight | 80KG (Including vacuum pump) | |
| Plasma Generator | Power | 0–300W, continuously variable output |
| Frequeny | 13.56 MHz | |
| Chamber | Material | Stainless Steel |
| Form | Cylindrical | |
| Volume | 22.8L | |
| Dimensions | 380(L)*375(D)*160(H)mm | |
| Process Control | Interface | 4.3” with recipe store+PLC |
| Gas Channel Options | Float Flowmeter/x2 MFC (customizable) | |
| Services | Electrical | AC220, 50–60Hz |
| Power Cord | Suited to region |
PRODUCT FEATURES
Fast Deposition Rate
Good Film Quality
Process Stability
High Productivity
Fully Automatic
Simple Operation
Plasma
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