NE-PE13F Micro Plasma Cleaning Machine
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DESCRIPTION

NE-PE13F is a micro plasma cleaning machine. It is microprocessor controlled benchtop plasma treatment systems which are ideally suited to surface activation, cleaning and modification of a wide range of materials including polymers, metals, glass and ceramics.


NE-PE13F has a range of gas inlet options to suit budget and application; fixed, single MFC, dual MFC and vapour delivery. With precision flow control and integrated pressure gauge, the NE-PE13F delivers unmatched reliability & repeatability by removing common errors in gas flow and gas type settings which will be familiar to users of equivalent equipment that utilise manual needle valves.


Address specific material treatments including:


  • Plasma cleaning

  • Plasma surface activation to improve adhesion

  • Functional plasma coatings

  • Plasma etching

  • PDMS & microfluidic devices

  • PEEK & other engineering polymers

  • PTFE

  • Metals

  • Ceramics

  • Glass & optical devices


Micro Plasma Cleaning Machine NE-PE13F

The NE-PE13F Micro Plasma Cleaning Machine is a benchtop plasma system engineered for cleaning small components and delicate surfaces in precision industries. It delivers controlled plasma energy for removing micro-level contaminants and preparing surfaces for improved adhesion.

Applications

  • PCB and IC packaging surface cleaning

  • MEMS and microfluidics device treatment

  • Watch and optical instrument cleaning

  • Lab-scale R&D surface preparation

Advantages

  • Compact design for lab or desktop use

  • Easy operation with digital touchscreen control

  • Supports air, oxygen, and argon plasma

  • Precise cleaning without chemical exposure

Working Process

  1. Place the sample on the removable tray

  2. Chamber is pumped to low vacuum (≤100 Pa)

  3. Process gas is introduced and plasma is generated

  4. Surface contaminants are removed through plasma reactions

  5. System vents and sample is ready for downstream use

Technical Specifications

  • Chamber size: 130 × 130 × 130 mm

  • RF Power: 0–100 W

  • Supported gases: Air, O₂, Ar

  • Vacuum level: ≤100 Pa

  • Sample tray: 110 × 110 mm

PARAMETER

EnclosureDimensions600mm(L)×550mm(W) ×580 mm(H)
Weight80KG (Including vacuum pump)
Plasma GeneratorPower0–300W, continuously variable output
Frequeny13.56 MHz
ChamberMaterialStainless Steel
FormCylindrical
Volume13.5L
Dimensions240(L)×280(D)x 200mm (H)mm
Process Control

Discharge Modes

CCP & RIE

Interface4.3” with recipe store+PLC
Gas Channel OptionsFloat Flowmeter/x2 MFC (customizable)
Flow Value0-500ml
ServicesElectricalAC220, 50–60Hz
Power CordSuited to region

PRODUCT FEATURES

01

Fast Deposition Rate

Fast Deposition Rate

02

Good Film Quality

Good Film Quality

03

Process Stability

Process Stability

04

High Productivity

High Productivity

05

Fully Automatic

Fully Automatic

06

Simple Operation

Simple Operation

RELATED PRODUCTS

Contact
  • +86 173 0440 3275
  • luwanjun@naentech.cn
  • Huaming City, Guangming District, Shenzhen, Guangdong, China
Custom Plasma Equipment

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