Low-pressure Desktop Plasma Cleaner NE-PE25H
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DESCRIPTION

The Desktop Plasma Cleaner NE-PE25H represents a high-performance low-temperature plasma system, integrating a Mass Flow Controller (MFC) for accurate process gas regulation and a Pirani precision resistance vacuum gauge capable of 0.1% measurement accuracy. This configuration ensures reliable operation in demanding laboratory and industrial environments.

Widely applied in material processing, low-temperature plasma systems utilize energetic particles to induce physical and chemical interactions with material surfaces. These processes—including activation, cleaning, etching, and doping—significantly improve key surface characteristics such as surface energy, hydrophilicity, and adhesion.

Key Advantages of Dry Plasma Treatment

  1. Eco-Efficient Processing: Eliminates drying stages, liquid waste, and exhaust treatment associated with wet methods, reducing energy use while ensuring operator safety and environmental compatibility.

  2. Universal Adaptability: Ensures uniform treatment even on complex surface geometries.

  3. Rapid & User-Friendly Operation: Provides visible results within seconds to minutes through straightforward procedures.

  4. Surface-Selective Modification: Modifications are limited to surface depths ranging from angstroms to micrometers, preserving bulk material properties while enhancing surface functionality.

PARAMETER

ENCLOSUREDimensions650 × 649 × 666 mm(L × W × H)

PLASMA POWER SUPPLY 

Power0-1000W, continuously variable output
Frequency40 kHz (optional: 13.56MHz)

CHAMBER

MaterialStainless Steel
Dimensions380 × 390 × 170 mm (L × D × H), 25L
Effective Processing Area332(W)×320(D)×30(H)mm
Shelves2

PROCESS CONTROL

InterfacePLC with 7'' Touch Screen HMI
Gas Channelsx2 MFC, compatible with O₂, Ar, N₂, H₂, etc.
Pressure GaugePirani Sensor

SERVICES

Electrical210-250 VAC, 50-60Hz
Power CordSuited to region
ComplianceCE


PRODUCT FEATURES

01

Fast Deposition Rate

Fast Deposition Rate

02

Good Film Quality

Good Film Quality

03

Process Stability

Process Stability

04

High Productivity

High Productivity

05

Fully Automatic

Fully Automatic

06

Simple Operation

Simple Operation

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