DESCRIPTION
The NAEN plasma cleaning system (quartz chamber system) is a tabletop plasma chemistry reactor designed for R&D and production. Used for plasma cleaning, argon plasma, oxygen plasma, PDMS bonding, oxygen plasma treatment, photo resist stripping, FA applications, Parylene removal, organic removal and lab or production use.
The NAEN plasma cleaning system is the most efficient system of its kind on the market because of its variable 10 watt to 300 watt, 13.56 MHz solid state generator. Power (watts) can be adjusted in one watt increments. The NAEN plasma system is also designed to efficiently breakdown gases introduced to the system creating reactive species that will quickly clean or modify the sample. Automatic tuning and a pressure readout are included.
The system of the NE-Q05H small plasma cleaning equipment includes a vacuum chamber, an RF generator, a vacuum pump, and inlet and outlet ports. The processor is of the capacitive coupled external electrode type, and the processing chamber is made of cylindrical quartz glass. The processor of this device adopts the external electrode type, which can avoid the problems of electrode corrosion and reactant deposition on the electrode plate.
The NE-Q05H system is designed for 200 mm substrates or 8″ wafers, and can perform RIE or plasma processing–depending on which sample carrier used. The anodized aluminum chamber can accommodate standard O2, Ar, SF6, or CF4 type gases for various applications.
The NE-Q05H can be used for a variety of applications from plasma activation, plasma cleaning, organic removal, pre-deposition cleaning as well as etching applications. The process chamber is anodized aluminum.
Benefits
It provides the users the ability to adjust various parameters, such as time, pressure, and power, to achieve the desired results. As the technology doesn’t require any special treating gases, it can function with clean, dry air or a combination of oxygen and argon for specific chemical changes.
PARAMETER
Technical Specifications | |
NE-Q05H Low Pressure Plasma Treatment Systems | |
ENCLOSURE | |
Dimensions | 548mm(L)×588mm(W) ×617 mm(H) |
PLASMA POWER SUPPLY | |
Mains voltage and frequency | 220 VAC 50/60 Hz |
Output voltage/plasma power | 0-200W (adjustable) |
PROCESS CONTROL | |
Process gas | Standard: air, oxygen, argon, nitrogen on request |
Plasma generator | 13.56MHz |
Vacuum gauge | Pirani |
Interface | 4.3’’ PLC+HMI |
CHAMBER | |
Dimensions | Φ150×280(D)mm |
Form | Cylindrical |
Volume | 5L |
Material | Quartz |
PRODUCT FEATURES
Fast Deposition Rate
Good Film Quality
Process Stability
High Productivity
Fully Automatic
Simple Operation
Plasma
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