The NE-OP20F is a compact low-pressure oxygen plasma system engineered for precision surface treatment, organic contaminant removal, and functional activation. Utilizing high-purity oxygen plasma, it provides a clean, solvent-free alternative to wet chemical methods, making it ideal for semiconductor, optical, and biomedical applications.

Operating under low-pressure (high vacuum) conditions, oxygen plasma reacts with surface molecular layers, breaking down organic contaminants and converting them into volatile compounds that are evacuated from the chamber.

Key Strengths

1. Highly effective removal of organic residues (grease, oils, polymers)

2. Powerful disinfection and sterilization capability

3. Surface activation through OH-group incorporation

4. Hydrophilic modification of material surfaces

5. Precision etching of sensitive substrates

Applications

1. Bioeconomy & Biotechnology: Device sterilization, surface functionalization

2. Advanced Materials & Circular Economy: Surface activation, polymer treatment

3. Science for Engineering: R&D in materials, optics, and semiconductors

4. Social Innovation & Open Science: Education, research, and prototyping

Technical Specifications

1. Chamber Dimensions: 380 × 375 × 160 mm

2. RF Power: 0–300 W (13.56 MHz)

3. Operating Pressure: ≤100 Pa

4. Process Gases: O₂, Ar, N₂

5. Control System: Programmable touchscreen interface

Process Workflow

1. Sample loading into vacuum chamber

2. Evacuation to operating vacuum (≤100 Pa)

3. Oxygen introduction and RF plasma ignition

4. Plasma-surface interaction (conversion to CO₂/H₂O)

5. System venting and sample retrieval

Advantages

1. Low-temperature, environmentally friendly processing

2. Uniform plasma distribution for consistent results

3. Programmable recipes for repeatable performance

4. Non-destructive treatment of delicate structures