Low-pressure Desktop Plasma Cleaner NE-Q03H
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DESCRIPTION

The NE-Q03H Desktop Plasma Cleaner is a high-precision system engineered for advanced surface cleaning and functional modification. It utilizes plasma technology to efficiently remove organic and inorganic contaminants while enabling tailored surface optimization. By introducing process gases such as hydrogen, oxygen, or helium, the system generates a highly reactive plasma under a high-energy electric field. This plasma, composed of energetic electrons, ions, and radicals, interacts with the substrate surface through both physical bombardment and chemical reactions, effectively decomposing or desorbing contaminants for thorough cleaning.

Moreover, the system allows controlled surface modification by selecting specific gases and process parameters. This enables the grafting of functional groups to enhance key properties including wettability, adhesion strength, and biocompatibility—making it suitable for applications in microelectronics, optical device fabrication, and biomedical materials.

Product Features

  1. Automated Door System – Ensures hands-free operation and reliable vacuum sealing

  2. 7'' Color Touchscreen – Intuitive interface displaying real-time process parameters

  3. Mass Flow Controller (MFC) – Delivers precise and repeatable gas flow regulation

  4. Manual/Auto Mode Switching – Supports multi-recipe storage with full process traceability

  5. Ergonomic 45° Tilt Control Panel – Designed for comfortable and user-friendly operation

PARAMETER

ENCLOSUREDimensions552 × 612 × 520 mm(L × W × H)

PLASMA POWER SUPPLY 

Power0-300W, continuously variable output
Frequency13.56MHz (optional: 40kHz)

CHAMBER

MaterialQuartz
Dimensions105 × 300 mm (Φ × D), 2.8L
Effective Processing Area95 × 240 mm (Φ × D)

PROCESS CONTROL

InterfacePLC with 7'' Touch Screen HMI
Gas Channelsx2 MFC, compatible with O₂, Ar, N₂, H₂, etc.
Pressure GaugePirani Sensor

SERVICES

Electrical210-250 VAC, 50-60Hz
Power CordSuited to region
ComplianceCE


PRODUCT FEATURES

01

Fast Deposition Rate

Fast Deposition Rate

02

Good Film Quality

Good Film Quality

03

Process Stability

Process Stability

04

High Productivity

High Productivity

05

Fully Automatic

Fully Automatic

06

Simple Operation

Simple Operation

INDUSTRY APPLICATION

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