DESCRIPTION
The NE-Q03H Desktop Plasma Cleaner is a high-precision system engineered for advanced surface cleaning and functional modification. It utilizes plasma technology to efficiently remove organic and inorganic contaminants while enabling tailored surface optimization. By introducing process gases such as hydrogen, oxygen, or helium, the system generates a highly reactive plasma under a high-energy electric field. This plasma, composed of energetic electrons, ions, and radicals, interacts with the substrate surface through both physical bombardment and chemical reactions, effectively decomposing or desorbing contaminants for thorough cleaning.
Moreover, the system allows controlled surface modification by selecting specific gases and process parameters. This enables the grafting of functional groups to enhance key properties including wettability, adhesion strength, and biocompatibility—making it suitable for applications in microelectronics, optical device fabrication, and biomedical materials.
Automated Door System – Ensures hands-free operation and reliable vacuum sealing
7'' Color Touchscreen – Intuitive interface displaying real-time process parameters
Mass Flow Controller (MFC) – Delivers precise and repeatable gas flow regulation
Manual/Auto Mode Switching – Supports multi-recipe storage with full process traceability
Ergonomic 45° Tilt Control Panel – Designed for comfortable and user-friendly operation
PARAMETER
| ENCLOSURE | Dimensions | 552 × 612 × 520 mm(L × W × H) |
PLASMA POWER SUPPLY | Power | 0-300W, continuously variable output |
| Frequency | 13.56MHz (optional: 40kHz) | |
CHAMBER | Material | Quartz |
| Dimensions | 105 × 300 mm (Φ × D), 2.8L | |
| Effective Processing Area | 95 × 240 mm (Φ × D) | |
PROCESS CONTROL | Interface | PLC with 7'' Touch Screen HMI |
| Gas Channels | x2 MFC, compatible with O₂, Ar, N₂, H₂, etc. | |
| Pressure Gauge | Pirani Sensor | |
SERVICES | Electrical | 210-250 VAC, 50-60Hz |
| Power Cord | Suited to region | |
| Compliance | CE |
PRODUCT FEATURES
Fast Deposition Rate
Good Film Quality
Process Stability
High Productivity
Fully Automatic
Simple Operation
Plasma
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