DESCRIPTION
The NE-Q05H is a compact quartz-chamber plasma system designed for precision cleaning and surface activation of diverse materials—including polymers, metals, glass, and ceramics—significantly improving adhesion performance even on challenging surfaces.
Utilizing an Inductively Coupled Plasma (ICP) source, the system delivers high plasma density and dissociation rates. With all electrodes positioned outside the vacuum chamber, it eliminates internal electrode sputtering and contamination risks.
The chamber is constructed entirely of quartz glass, chosen for its excellent temperature resistance, ease of cleaning, mechanical strength, and full RF power transmission capability—making it an ideal material for high-purity processing environments.
Semiconductor wafer post-etch residue removal
MEMS packaging and TSV cleaning
Advanced material research surface conditioning
Sub-10nm cleaning and nano-coating prep
Dual Independent Gas Lines: Support single or mixed gas introduction for flexible process design
Integrated Control System: Combines automated process control, real-time data logging, and safety interlock protection
Fully Configurable Parameters: Allows adjustment of power, time, and other key variables with full process traceability
Optimized for demanding applications in microelectronics, material science, and R&D, the NE-Q05H delivers contamination-free, repeatable plasma processing for advanced surface preparation.
PARAMETER
| ENCLOSURE | Dimensions | 548 × 588 × 617 mm(L × W × H) |
PLASMA POWER SUPPLY | Power | 0-300W, continuously variable output |
| Frequency | 13.56MHz | |
CHAMBER | Material | Quartz |
| Dimensions | 150 × 270 mm (Φ × H), 4.7L | |
| Effective Processing Area | 126 × 250 mm (Φ × H) | |
PROCESS CONTROL | Interface | PLC with 7'' Touch Screen HMI |
| Gas Channels | x2 MFC, compatible with O₂, Ar, N₂, H₂, etc. | |
| Pressure Gauge | Pirani Sensor | |
SERVICES | Electrical | 210-250 VAC, 50-60Hz |
| Power Cord | Suited to region | |
| Compliance | CE |
PRODUCT FEATURES
Fast Deposition Rate
Good Film Quality
Process Stability
High Productivity
Fully Automatic
Simple Operation
Plasma
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