DESCRIPTION
Vertical Plasma Cleaning Machine is a industrial low pressure plasma treatment system, equipped with high power, large cavity, high density, high stability, for large-scale continuous production.
Vertical Plasma Cleaning Machine is used in a wide range of fields, from the manufacture of semiconductors and electronic components to medical applications. Plasma treatment cleans materials by decomposing and vaporizing microscopic organic matter adhering to the material surface. It also has the effect of surface modification by breaking molecular bonds on the material surface and changing the surface composition. In addition, the plasma decorates the surface of the material with hydroxyl groups, making it hydrophilic and less likely to repel liquids.
Advantages:
The plasma cleaning machine has high cleaning efficiency and a wide range of applications;
There are no requirements for the appearance, size, material, etc. of the cleaning sample;
During the cleaning process, the temperature rise is relatively small and can basically reach room temperature;
The RF power can be continuously adjusted, and the efficient special electrode is the guarantee for the generation of uniform plasma;
The unique overload, overheating and short-circuit protection circuit can ensure the stability and safety of the RF power supply;
The equipment adopts a modular design, and installation and maintenance are extremely simple.
NE-PE40F is widely used in scientific research institutions, enterprise R&D units and small batch production, including:
Plasma cleaning organics
Plasma surface activation to improve adhesion
Form new functional groups and improve hydrophilicity
Wafer Cleaning, remove the photoresist
ITO & FTO & Glass & Pottery &Metal
PP & PET & PVC & PEEK & PC
PARAMETER
Enclosure | Dimensions | 685mm(L) X 830m (w) X 1450mm (H) |
Weight | 300KG(Including vacuum pump) | |
Plasma Generator | Frequency | 13.56Mhz |
Power | 50-500w(Adjustable) | |
Chamber | Material | Aviation-grade aluminum alloy |
Dimensions | 350(L)×405(D)×300(H)mm | |
Volume | 42L | |
Process Layers | 4 | |
Discharge Modes | CCP & RIE | |
Process Control | Gas Flow Controller | MFC |
Flow Value | 0-500 SCC | |
Gas Channel | 2 | |
Vacuum Gauge | Pirani | |
Interface | 7’’with recipe store+PLC | |
Services | Electrical | AC220, 50–60Hz |
Power Cord | Suited to region |
PRODUCT FEATURES
Fast Deposition Rate
Good Film Quality
Process Stability
High Productivity
Fully Automatic
Simple Operation
Plasma
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