Four-Lane Inline Plasma System has been designed to sustain all the demands of a 24/7 continuous inline production environment where large-scale production volumes are top priority. Four-Lane Inline Plasma System's main advantage is its two independent plasma chambers. Each plasma chamber can accommodate the loading and unloading of two carriers at the same time in one movement; the total four carriers in the machine are then processed in parallel guaranteeing a high throughput production.

Four-Lane Inline Plasma System conveyors systems can be configured to accept one or two carriers from the upstream conveyor at once as well as providing one or two carriers to the downstream system at once.

Advanced traceability options are available on this system to easily integrate with a variety of Manufacturing Execution Systems (MES).

• In manufacturing, QML-4CI is typically used for:

• Plasma cleaning before wire-bonding on modules

• Plasma cleaning before transfer molding on modules

• Plasma cleaning on PCBs, BGA substrates

Four-Lane Inline Plasma System has been used in a range of applications within the Semiconductors and Automotive industries.

This device realizes automatic transmission and cleaning of lead frames, automatically removing the lead frames from the material box and performing plasma cleaning to remove surface contamination, improve surface activity, and then automatically placing them back into the material box without human interference throughout the process. The track width is adjustable and compatible with products of different specifications and sizes. Independent chip cleaning greatly improves cleaning uniformity.

As a precision dry cleaning equipment, four-Lane Inline Plasma System can effectively remove pollutants, improve material surface properties, and has advantages such as high automation, high cleaning efficiency, high equipment cleanliness, and wide adaptability.