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PCBA plasma cleaning improves the reliability of power module plastic packaging and reduces delamination
PCBA plasma cleaning improves the reliability of power module plastic packaging and reduces delamination Plasma cleaning can significantly enhance the wetting tension between PCBA substrate, ink, and magnetic core surface, change their surface microstructure, and increase surface roughness. The proportion of PCBA substrate and plastic seal layer delamination in the module power supply after plasma cleaning has decreased from 45% to about 6%

Jun. 08, 2026

Surface plasma treatment process of ABF resin
Surface plasma treatment process of ABF resin After plasma treatment, the bonding performance of ABF resin (Ajinomoto deposition film) can be significantly improved. The core is the combined effect of cleaning, activation, and micro etching, which changes the surface from weak polarity to high polarity and from smooth to micro rough.

Jun. 08, 2026

Plasma cleaning of vulcanized rubber improves adhesion
Plasma cleaning of vulcanized rubber improves adhesion Plasma cleaning can significantly improve the surface energy of rubber and promote the adhesion between vulcanized rubber and vulcanized rubber, as well as between vulcanized rubber and metal. This is because plasma cleaning can cause changes in the physical morphology and chemical structure of the material surface, or produce etching and roughness

Jun. 01, 2026

Principle of hydrogen plasma cleaning SIC silicon carbide
Principle of hydrogen plasma cleaning SIC silicon carbide In addition to hydrogen atoms, hydrogen ions, and electrons, there are also electrically neutral hydrogen atoms or atomic groups (also known as free radicals) in an excited state, as well as the light emitted by the hydrogen plasma during the hydrogen plasma cleaning process.

Jun. 01, 2026

Application of plasma treatment technology in key electroplating processes for advanced glass based packaging
Application of plasma treatment technology in key electroplating processes for advanced glass based packaging In the key electroplating process of advanced packaging on glass substrates, plasma treatment is an important pre-treatment step before electroplating. For RDL and copper bump, the basic purpose of plasma pretreatment is relatively consistent, mainly including removing residual glue and suppressing surface oxidation of seed layer.

Jun. 01, 2026

Enhancing Hydrophilic Performance of PE Film by Low-temperature Plasma Treatment
Enhancing Hydrophilic Performance of PE Film by Low-temperature Plasma Treatment When subjected to low-temperature plasma treatment, polyethylene (PE) film will experience erosion, and the surface roughness of the material will increase, which is beneficial for improving hydrophilicity. At the same time, the surface of the processed polyethylene (PE) film will introduce polar groups.

May. 25, 2026

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