As a new type of surface treatment technology, oxygen plasma cleaning technology has been widely used in electronics, semiconductor, medical, aviation, and other high-tech fields that require high-purity surfaces and industrial manufacturing. This gas can be guided to the surface of the object that needs surface treatment for cleaning and modification under controllable conditions.

The technology generates a glow discharge through a high-voltage electrode, and the oxygen molecules are ionized under the action of an electric field. After the ionized oxygen ions collide with external electrons, they recombine to form chemical components such as free radicals or molecules. At this time, there are electrons, free radicals, ions, and neutral molecules in the reaction chamber. The interaction and collision between various components occur repeatedly, and the transfer of mass and energy occurs repeatedly, forming a very active chemical physical reaction system. The plasma formed by the discharge or the chemical active substance activated by the plasma reacts with the surface of the material. The active oxygen in the plasma oxidizes the organic matter on the surface of the material. The oxygen plasma interacts with the organic matter on the surface of the material to generate volatile molecules such as CO, which enhances the adhesion of the material surface and improves the hydrophilicity of the surface. Oxygen plasma reduces the content of scale and oil on the surface by chemical reaction, so that the surface cleanliness is greatly improved. At the same time, plasma cleaning during the reprocessing process can increase the surface activity. After oxygen plasma cleaning, reactive gas is introduced, and chemical reactions occur on the surface of the material to form new functional groups, such as hydroxyl groups, carboxyl groups, etc., and surface free radicals, forming a cross-linked structural layer, which makes the surface characteristics of the material mutate, and then obtain a new chemical structure, making it easier to wet and diffuse. 

Oxygen plasma cleaning organic matter schematic diagram

Oxygen plasma cleaning has the characteristics of low temperature, no pollution, high efficiency, fast and easy to control. Under the chemical reaction conditions of plasma, the surface treatment temperature is lower than that of traditional technology, so the energy consumption can be greatly reduced under the premise of ensuring the quality of the product itself. Oxygen plasma cleaning technology does not produce any harmful substances such as waste gas, waste water and waste residue, which reduces pollution and waste treatment costs.

In general, oxygen plasma cleaning technology is a green, efficient and fast surface treatment technology. Under the treatment of this technology, the surface hydrophilicity of the material is improved, which provides great convenience for the subsequent substrate treatment process. At the same time, with the progress of science and technology and the deepening of understanding, oxygen plasma cleaning technology will be more refined, and its treatment of material surface will be more controllable.