Plasma treatment technology is a technique that uses high-energy particles of plasma to modify the surface of materials, and is widely used in fields such as materials science, semiconductor manufacturing, and surface engineering. Plasma, commonly known as the fourth state of matter, is an ionized gas containing free electrons, ions, neutral atoms, and excited molecules. In plasma processing, plasma is generated by applying a high-energy electric field to the gas, and its high-energy particles interact with the material surface, achieving various effects such as cleaning, etching, deposition of thin films, surface activation, and functionalization. Due to its ability to significantly improve the adhesion, hydrophilicity, corrosion resistance, and other properties of material surfaces without altering their intrinsic properties, it plays an important role in material defect control, particularly in the fields of semiconductors, nanomaterials, and surface engineering. By precisely controlling the composition, energy, and exposure time of the plasma, defects on the surface and near surface areas of the material can be effectively manipulated, thereby optimizing the electrical, optical, and chemical properties of the material. Its main applications include:

(1) Defect removal: Plasma cleaning is a common method for removing surface contamination and repairing surface defects. High energy particles can break and remove surface pollutants, while bombarding the surface can remove or reconstruct surface defects such as dislocations and vacancies, thereby reducing defect density and improving material properties.

(2) Defect introduction: Specific defects, such as doped atoms or tiny grain boundaries, are beneficial for specific applications of materials. Plasma treatment can introduce new defects on the surface of materials through bombardment or introduce doped atoms through plasma assisted ion implantation technology, thereby adjusting the conductivity, light absorption properties, or catalytic activity of materials.

(3) Surface modification: Plasma treatment can also alter the chemical and physical structure of material surfaces, enhancing surface activity by introducing surface defects or changing surface states. This is crucial for improving adhesion, enhancing coating adhesion, and increasing surface hydrophilicity or oleophilicity.

(4) Stress regulation: In thin film growth and micro nano processing, plasma treatment can be used to regulate the internal stress of thin films. By selecting appropriate plasma parameters, stress can be introduced or removed during the film growth process, thereby affecting the mechanical properties and stability of the film.

In summary, the ability to control defects through plasma treatment provides an effective means for manufacturing higher performance electronic devices, catalysts, and coating materials, and is an indispensable key technology in semiconductor manufacturing and research and development. Accurate process control and a deep understanding of the physical and chemical properties of plasmons are key to achieving these goals.