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Plasma cleaning improves the delamination phenomenon of lead frame plastic packaging
Plasma cleaning improves the delamination phenomenon of lead frame plastic packaging The surface treatment or modification of the lead frame before plastic packaging is a common technical means in the chip packaging process.

Jul. 14, 2025

Atmospheric and Low Pressure Plasma: A Detailed Comparison
Atmospheric and Low Pressure Plasma: A Detailed Comparison Plasma technology has emerged as a vital component across various industries, enabling advanced surface treatment capabilities that traditional methods cannot match.

Jul. 14, 2025

Plasma treatment improves the bonding strength between copper foil and resin in high frequency PCB substrate
Plasma treatment improves the bonding strength between copper foil and resin in high frequency PCB substrate Plasma treatment can effectively improve the bonding performance between low roughness copper foil and epoxy resin and polyphenylene ether resin in high frequency PCB substrate.

Jul. 10, 2025

Effect of plasma cleaning on bonding strength of pad surface and wire
Effect of plasma cleaning on bonding strength of pad surface and wire As a pretreatment process, plasma cleaning is widely used in semiconductor fields such as wire bonding, copper-copper bonding and hybrid bonding. Plasma cleaning can effectively reduce the number of contaminated particles on the surface of the pad and improve the strength of wire bonding.

Jul. 07, 2025

Plasma treatment improves the hydrophilicity of polylactic acid PLA film
Plasma treatment improves the hydrophilicity of polylactic acid PLA film Low-temperature plasma treatment can embed a variety of molecular chains on the surface of polymer molecules, giving them hydrophilicity and adhesion. After low temperature plasma treatment, the oxygen content on the surface of PLA film was improved.

Jul. 07, 2025

Plasma cleaning before gluing increases the adhesion of the adhesive.
Plasma cleaning before gluing increases the adhesion of the adhesive. Plasma cleaning technology is used on the surface of the cell before gluing. The surface of the cell is treated by using the properties of active components such as ions, electrons, atoms, active groups, and photons to achieve cleaning and increase the specific surface area of the cell, thereby better increasing the adhesion of the glue.

Jul. 04, 2025

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