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Desktop plasma cleaners are revolutionizing R&D labs
Desktop plasma cleaners are revolutionizing R&D labs Desktop plasma cleaners are revolutionizing R&D labs by bringing compact, precise surface treatment to workbenches. These tabletop units deliver low-pressure plasma cleaning, activation, and etching for small samples, enabling researchers to enhance adhesion, sterilize surfaces, and modify materials

Apr. 29, 2026

CO2 plasma treatment of PDMS film improves subsequent PeBax coating performance
CO2 plasma treatment of PDMS film improves subsequent PeBax coating performance The use of CO ₂ plasma for hydrophilic modification of PDMS membrane surface can provide a good interface for the hydrophilic PeBax coating solution to fully spread on its surface, and construct a defect free ultra-thin separation layer.

Apr. 24, 2026

Semiconductor dry cleaning technology
Semiconductor dry cleaning technology Semiconductor cleaning is a critical step in the semiconductor manufacturing process, aimed at removing impurities, organic compounds, metal ions, etc. from the surface of semiconductors to ensure the quality and performance of semiconductor devices.

Apr. 24, 2026

Ar-H2 plasma cleaning activated Ti nanofilm
Ar-H2 plasma cleaning activated Ti nanofilm Ar-H2 plasma cleaning activated Ti nanofilm can play the following roles: removing surface pollutants and cleaning the surface; Reduce the oxide on the surface of Ti nanofilm, generate Ti3+and Ti2+under the bombardment of Ar+, and generate Ti under the reduction of H radicals

Apr. 21, 2026

The effect of plasma cleaning activation on the hydrophilicity of SiC wafer surface
The effect of plasma cleaning activation on the hydrophilicity of SiC wafer surface In the experiment on the effect of plasma cleaning activation on the chemical state of SiC wafer surface, it was found that oxygen plasma removed the natural oxide layer on the wafer surface, produced free C-C impurities, and generated a new chemical structure Si-O-Si on the wafer.

Mar. 27, 2026

Principle of plasma cleaning process for drilling dirt on the hole wall of R-FPCB rigid flex bonding plate
Principle of plasma cleaning process for drilling dirt on the hole wall of R-FPCB rigid flex bonding plate Using plasma to remove drilling debris does not require the entire wet process line, reducing the cost of chemical treatment. During plasma cleaning to remove drilling debris, R-FPCB is placed in a vacuum chamber, and then gas is introduced and converted into plasma through a power source.

Mar. 26, 2026

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