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Plasma treatment before vacuum sealing improves adhesion performance
Plasma treatment before vacuum sealing improves adhesion performance Plasma treatment can improve the interfacial bonding and wetting properties of materials, enhance their adhesion. Therefore, plasma treatment can be applied to the surface of encapsulated components to increase their surface activity, enhance their wetting ability to the adhesive solution, and thus improve the bonding strength.

Jun. 03, 2025

Plasma treatment improves the properties of hollow glass microspheres/epoxy resin composite materials
Plasma treatment improves the properties of hollow glass microspheres/epoxy resin composite materials The active functional groups generated on the surface of hollow glass microspheres through plasma treatment can significantly improve their surface wettability, enhance the interaction force between hollow glass microspheres and epoxy resin interface, and effectively improve the mechanical properties of composite materials.

Jun. 03, 2025

Principle of plasma cleaning to remove residual organic matter on the surface of materials
Principle of plasma cleaning to remove residual organic matter on the surface of materials Plasma cleaning technology utilizes ionization to generate reactive particles, which, through the combination of high-energy particle physical bombardment and chemical reactions, break down the large molecule hydrocarbon pollutants adsorbed on the material surface and generate small molecule gaseous organic pollutants.

Jun. 03, 2025

Application of plasma cleaning before the three proof coating of PCB in aviation electronic products
Application of plasma cleaning before the three proof coating of PCB in aviation electronic products Plasma cleaning can effectively increase the surface tension in the interface parameters of PCB boards, that is, plasma cleaning can effectively improve its surface tension, achieve cleaning and activation of the surface of PCB boards, and thus effectively enhance the wetting ability of the three proof paint on the surface of PCB boards.

Jun. 03, 2025

Principle of reactive ion etching of silicon nitride (Si3N4)
Principle of reactive ion etching of silicon nitride (Si3N4) Reactive ion etching is a method that combines chemistry and physics, using gas plasma for etching in vacuum. Typically, fluorine based gas is used as the reactive gas for reactive ion etching of silicon nitride films, generating volatile gases that are extracted by the vacuum system to achieve the purpose of etching.

Jun. 03, 2025

Principle of plasma treatment on material surface
Principle of plasma treatment on material surface The energy of plasma can be applied to the surface of materials through light radiation, neutral molecular flow, and ion flow. The particles moving at high speed inside the plasma transfer their energy directly to the surface of the material through collisions.

Jun. 03, 2025

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