Four-Lane Online Plasma Cleaner
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DESCRIPTION

Our Four-Lane Online Plasma Cleaner is engineered for 24/7 continuous inline production—a top choice for large-scale manufacturing. Its core advantage lies in two independent plasma chambers: each chamber accommodates 2 carriers per load, enabling parallel processing of 4 carriers total to maximize throughput.The system supports flexible conveyor configuration (accepts 1-2 carriers from upstream/downstream) and integrates with various Manufacturing Execution Systems (MES) via advanced traceability options. It’s widely used for:

  • Plasma cleaning of semiconductor modules (before wire-bonding/transfer molding)

  • Surface activation of PCBs and BGA substrates

  • Automatic lead frame processing (loads/unloads from material boxes, no human interference)

Industry Applications 

  • Semiconductor Industry

    Plasma activation & cleaning for semiconductor components: Removes surface contaminants (oxides, organics) from modules (before wire-bonding/transfer molding) and BGA substrates, improving bonding reliability and product yield.

  • Automotive Industry

    Large-scale plasma processing for automotive interior/exterior components (dashboards, door panels, bumpers): Enhances surface adhesion before painting/bonding, ensuring durable coating performance.

  • LED & Consumer Electronics

    Plasma cleaning for LED packaging substrates: Boosts surface activity to improve die bonding and encapsulation quality.

    Plasma hydrophilic treatment for swimming goggles (before coating): Ensures uniform coating adhesion and long-lasting anti-fog performance.

FAQs

Q:What carrier sizes does the Four-Lane Inline Plasma System support?

A:It’s compatible with carriers of 120-270mm (length) and 40-83mm (width), with adjustable track width for different product specifications.

Q:Can the system integrate with our existing MES?

A:Yes—advanced traceability options are pre-installed to seamlessly connect with most Manufacturing Execution Systems (MES) in the semiconductor/automotive industries.

Q:What gases does the system use?

A:It has 2 process gas lines with MFC (Mass Flow Controller), supporting common plasma gases (e.g., argon, oxygen, nitrogen) based on your cleaning/activation needs.


PARAMETER

DimensionsL*W*H: 2000mm* 1200mm* 1700mm
Plasma Chamber ConfigurationTwo plasma chambers each containing two carriers
Product SizeCarrier: 120-270mm(L), 40-83mm(W)
Plasma GeneratorDouble 100W RF Generator 13.56 MHz
Automatic tuning system
Mains Voltage and Frequency1PH220V、40A、50 Hz
Gas Lines2 Process gas lines with MFlC


PRODUCT FEATURES

01

Fast Deposition Rate

Fast Deposition Rate

02

Good Film Quality

Good Film Quality

03

Process Stability

Process Stability

04

High Productivity

High Productivity

05

Fully Automatic

Fully Automatic

06

Simple Operation

Simple Operation

INDUSTRY APPLICATION

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