DESCRIPTION
Our Four-Lane Online Plasma Cleaner is engineered for 24/7 continuous inline production—a top choice for large-scale manufacturing. Its core advantage lies in two independent plasma chambers: each chamber accommodates 2 carriers per load, enabling parallel processing of 4 carriers total to maximize throughput.The system supports flexible conveyor configuration (accepts 1-2 carriers from upstream/downstream) and integrates with various Manufacturing Execution Systems (MES) via advanced traceability options. It’s widely used for:
Plasma cleaning of semiconductor modules (before wire-bonding/transfer molding)
Surface activation of PCBs and BGA substrates
Automatic lead frame processing (loads/unloads from material boxes, no human interference)
Semiconductor Industry
Plasma activation & cleaning for semiconductor components: Removes surface contaminants (oxides, organics) from modules (before wire-bonding/transfer molding) and BGA substrates, improving bonding reliability and product yield.
Automotive Industry
Large-scale plasma processing for automotive interior/exterior components (dashboards, door panels, bumpers): Enhances surface adhesion before painting/bonding, ensuring durable coating performance.
LED & Consumer Electronics
Plasma cleaning for LED packaging substrates: Boosts surface activity to improve die bonding and encapsulation quality.
Plasma hydrophilic treatment for swimming goggles (before coating): Ensures uniform coating adhesion and long-lasting anti-fog performance.
Q:What carrier sizes does the Four-Lane Inline Plasma System support?
A:It’s compatible with carriers of 120-270mm (length) and 40-83mm (width), with adjustable track width for different product specifications.
Q:Can the system integrate with our existing MES?
A:Yes—advanced traceability options are pre-installed to seamlessly connect with most Manufacturing Execution Systems (MES) in the semiconductor/automotive industries.
Q:What gases does the system use?
A:It has 2 process gas lines with MFC (Mass Flow Controller), supporting common plasma gases (e.g., argon, oxygen, nitrogen) based on your cleaning/activation needs.
PARAMETER
| Dimensions | L*W*H: 2000mm* 1200mm* 1700mm |
| Plasma Chamber Configuration | Two plasma chambers each containing two carriers |
| Product Size | Carrier: 120-270mm(L), 40-83mm(W) |
| Plasma Generator | Double 100W RF Generator 13.56 MHz Automatic tuning system |
| Mains Voltage and Frequency | 1PH220V、40A、50 Hz |
| Gas Lines | 2 Process gas lines with MFlC |
PRODUCT FEATURES
Fast Deposition Rate
Good Film Quality
Process Stability
High Productivity
Fully Automatic
Simple Operation
RELATED PRODUCTS
Plasma
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