Plasma etching is a surface treatment technology that changes the surface morphology of materials through physical sputtering or chemical reactions by bombarding the material surface with high-energy particles generated by gas ionization.
Schematic Diagram of Plasma Etching
The principle of plasma etching can be summarized in several steps:
1. Under low pressure, the reaction gas is ionized by radio frequency power to form a plasma, which mainly consists of electrons, ions, and reactive species (such as reactive radicals).
2. Reactive species react with the material surface to form volatile reaction products.
3. The reaction products detach from the material surface and are pumped out of the chamber by the vacuum system.
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