Vacuum Plasma Cleaner NE-IC08 is specifically engineered for cleaning LED packaging substrates. It effectively removes organic residues, oxides, and particulate contaminants from substrate surfaces, ensuring optimal conditions for subsequent processing.

Integrating plasma cleaning prior to die attachment, wire bonding, and encapsulation in the LED packaging process significantly enhances adhesion performance and bonding integrity. This critical step prevents encapsulation delamination, improves wire bonding quality, increases interfacial adhesion strength, enhances device reliability, and ultimately boosts production yield while reducing manufacturing costs.

Advanced Vertical Electrode Design

Unlike conventional horizontal plasma systems, the NE-IC08 features an innovative vertical electrode configuration. During chamber evacuation, the RF-excited plasma undergoes directional movement guided by the strategic placement of positive and negative electrodes. The activated plasma initially travels horizontally along the electrode path, then follows a controlled downward trajectory combining vacuum suction and gravitational forces. This unique motion pattern ensures optimal plasma impingement on substrate surfaces, delivering superior cleaning effectiveness and exceptional treatment uniformity.

Advantages

1. Rapid Processing Capability
   Accelerates production cycles by significantly reducing processing time, enabling manufacturers to meet demanding delivery schedules.

2. Exceptional Treatment Quality
   Delivers consistent surface activation that eliminates yield loss due to inadequate adhesion, reducing material waste and rework.

3. Continuous Operation Reliability
   Engineered for 24/7 industrial operation with outstanding process stability, minimizing unplanned downtime and increasing equipment utilization.

4. Seamless Production Integration
   Designed for straightforward implementation into automated manufacturing lines, supporting high-volume production requirements.

Applications

1. Electronics: PCB surface activation, LED packaging adhesion enhancement

2. Automotive: Weatherstrip coating pretreatment, sensor housing cleaning

3. Medical: Syringe barrel sterilization, medical adhesive tape bonding

4. Packaging: Plastic film printing preparation, food packaging anti-fog treatment