NE-PE210F is a vacuum plasma cleaning equipment suitable for large-scale industrial production. Plasma cleaning achieves the purpose of cleaning by chemically reacting the active ions in it with the surface of the object. For example, oxygen is used to clean the organic matter on the surface of the object, producing an oxidation reaction, and the oxygen plasma and pollutants produce carbon dioxide, carbon oxide and water. The plasma formed by nitrogen ionization can react critically with some substructures, so it is also an active gas, but compared with oxygen and hydrogen, the particles are relatively heavy; while cleaning and activating, it can achieve a certain bombardment and etching effect to prevent oxidation of some metal surfaces. Nowadays, plasma cleaning machines are widely used in contemporary semiconductors, circuits and other industries. Before component packaging and chip bonding, plasma cleaning can be used. Its advantages are high cleaning efficiency and no damage to the sample surface, thereby improving product quality.