The NE-Q15 Inductively Coupled Plasma (ICP) Cleaner utilizes an RF power supply to generate high-density plasma by inductively coupling energy into process gases within a quartz chamber. The ICP source maintains stable plasma density even at low operating pressures, significantly minimizing substrate exposure to high-energy ion bombardment. Engineered with a high-purity quartz glass reaction chamber, the system ensures an ultraclean processing environment. Its electrode-free design fundamentally eliminates contamination risks associated with electrode sputtering.

Applications

1. Cleaning: Effective removal of organic residues, oxides, metal salts, and nanoscale particulate contaminants.

2. Activation: Surface modification including hydrophilicity/hydrophobicity control, adhesion promotion, surface energy enhancement, functional group incorporation, and biocompatibility improvement.

3. Etching: Precision surface patterning, micro-etching, and controlled modification of surface topography and roughness.

4. Bonding: Surface activation for PDMS microfluidic device assembly and wafer-level bonding preparation.

5. Photoresist Stripping: Complete photoresist ashing and bottom-layer residue removal.