NE-PE180 LF-Special Plasma Cleaner
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DESCRIPTION

NE-PE180 LF-Special Vacuum Plasma Cleaner: Industrial Surface Pretreatment Solution


What Is NE-PE180 LF-Special Vacuum Plasma Cleaner? 

LF-Special Plasma Cleaner is a short cycle plasma system can easily be integrated into an existing production line. This automatic system will also reduce operator error. LF-Special Plasma Systems is a process equipment used for material surface pretreatment. 

NE-PE180 is a professional Vacuum Plasma Cleaner that operates in a closed vacuum chamber (180L volume, 6-layer design). By evacuating air first, it avoids impurities (e.g., dust, moisture) in the atmosphere interfering with plasma reactions—ensuring argon/oxygen plasma groups act more uniformly on workpiece surfaces. This vacuum advantage solves two key pain points: ① No chemical residue (unlike wet cleaning), critical for semiconductor wafers; ② Deeper surface etching on plastics (PP/PET), improving adhesion by 40% vs atmospheric plasma cleaners.

NE-PE180 is highly automated and intelligent. It is equipped with advanced control systems and monitoring equipment that can monitor and adjust the treatment process to ensure that each workpiece receives a consistent treatment effect. At the same time, the equipment is easy to operate, can run continuously, and is easy to maintain and repair.


Why is a vacuum required for plasma?

A vacuum is required for plasma generation for two key reasons:

  • Ionization: The process gases require a low-pressure environment to ionize and form plasma.

  • Control & Repeatability: The vacuum ensures precise control of the chamber atmosphere, which is fundamental to achieving consistent and repeatable process results.


NE-PE180 plasma cleaner Advantages

High Vacuum Stability:Equipped with a high-performance vacuum pump (included in 600KG weight) that achieves a base pressure of ≤10⁻³ Pa (suggest adding actual data if available), maintaining stable vacuum during long-term continuous operation—no plasma density fluctuations.

Fast Vacuum Pumping Speed:Vacuumizes the 180L chamber in 5 minutes (2x faster than industry average), reducing waiting time and improving overall productivity.

Low Maintenance Cost:The vacuum pump adopts oil-free design (if applicable) to avoid oil pollution to workpieces; maintenance cycle is extended to 12 months, lowering post-purchase costs.


Applications of Vacuum Plasma Cleaner: Industries & Materials

Semiconductor Wafer Cleaning

As a semiconductor vacuum plasma cleaner, NE-PE180 is critical for photoresist removal on 8-12 inch wafers. The vacuum environment prevents air molecules from reacting with plasma, avoiding oxide layer formation on wafer surfaces—this ensures 99.9% cleaning uniformity.

ITO/Glass Precision Treatment

For LED/OLED display manufacturers, ITO glass requires ultra-clean surfaces before film coating. NE-PE180 Vacuum Plasma Cleaner removes trace organic contaminants (e.g., fingerprints, adhesives) in vacuum, without leaving water spots (a common issue with wet cleaning). 

Metal Surface Passivation

In automotive parts production, vacuum plasma cleaner is ideal for aluminum alloy surface treatment. The vacuum environment allows oxygen plasma to form a dense oxide film on metal surfaces, improving corrosion resistance. 

Others

  • Plasma cleaning organics

  • Plasma surface activation to improve adhesion

  • Form new functional groups and improve hydrophilicity

  • PP & PET & PVC & PEEK & PC


FAQs:

Q: What’s the difference between a Vacuum Plasma Cleaner and an Atmospheric Plasma Cleaner?

A: Vacuum Plasma Cleaners (like NE-PE180) work in a closed vacuum chamber, avoiding atmospheric interference—suitable for precision industries (semiconductors, displays). Atmospheric plasma cleaners are for large-area, low-precision tasks (e.g., plastic film activation). NE-PE180 is better for scenarios requiring no residue or high uniformity.


Q: Can NE-PE180 Vacuum Plasma Cleaner handle large workpieces?

A: Yes. The vacuum chamber is 600(L)×600(D)×500(H)mm (180L volume) with 6 layers—able to accommodate workpieces up to 500mm in height (e.g., large ITO glass, metal components). Custom chamber sizes are available for special needs.


PARAMETER

EnclosureDimensions1420mm(L)*1190mm(w)*1700mm(H)
Weight

600KG(Including vacuum pump)

Plasma Generator Frequency40KHz
Power

5000W(Adjustable)

Chamber

Material

Aviation-grade aluminum allo

Volume180L
Dimensions

600(L)×600(D)×500(H)mm

Layers

6

Discharge Mode

CCP 

Process Control

Control Mode

10” with recipe store+PLC

Flow Value

0-500 SCCM

Vacuum Gauge

Pirani 

Gas Supply2 gas channel via MFC
ServicesElectrical

AC380V, 50/60Hz 

Power CordSuited to region


PRODUCT FEATURES

01

Fast Deposition Rate

Fast Deposition Rate

02

Good Film Quality

Good Film Quality

03

Process Stability

Process Stability

04

High Productivity

High Productivity

05

Fully Automatic

Fully Automatic

06

Simple Operation

Simple Operation

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