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Plasma modification of carbon paper improves its binding performance with catalysts
Plasma modification of carbon paper improves its binding performance with catalysts After low-temperature plasma treatment, the physical properties of carbon paper change from hydrophobicity to hydrophilicity, and the surface roughness increases, with more peaks and valleys with certain height differences distributed on the surface.

Jan. 23, 2026

PI thin film plasma treatment improves adhesion
PI thin film plasma treatment improves adhesion Plasma treatment increases the surface free energy of PI film and improves surface wettability. The high-energy substances in the plasma form free radicals on the surface of the PI film, which then react with oxygen in the air to generate characteristic functional groups such as - OH, - COOH, - CO -, etc.

Jan. 23, 2026

PEEK plasma cleaning machine modification treatment improves hydrophilic adhesion
PEEK plasma cleaning machine modification treatment improves hydrophilic adhesion The principle of plasma cleaning machine modifying the surface of PEEK mainly involves introducing oxygen-containing active particles onto its surface. Due to the hydrophilic nature of these oxygen-containing active particles, the surface of PEEK also exhibits hydrophilic properties.

Jan. 15, 2026

Main adjustment parameters of reactive ion etching machine
Main adjustment parameters of reactive ion etching machine Reactive ion etching is an etching process that combines plasma chemical reactions (chemical etching) with high-energy ion bombardment (physical etching). The adjustment parameters of a reactive ion etching machine mainly include discharge power, reaction chamber pressure, and etching gas flow rate.

Jan. 14, 2026

Principle of Plasma Etching for PI Polyimide Films
Principle of Plasma Etching for PI Polyimide Films As a polymer, PI is primarily composed of carbon and hydrogen. Plasma treatment of PI using different types of gases yields distinct processing effects. Plasmas such as Ar and N₂ act on the PI layer mainly through physical bombardment, while O₂ and CF₄ plasmas treat and remove the PI layer primarily via chemical reactions.

Jan. 05, 2026

Application of Plasma Cleaning in the Underfill Process of Flip Chip Packaging
Application of Plasma Cleaning in the Underfill Process of Flip Chip Packaging In the flip chip packaging process, the fluidity of underfill adhesive determines the filling efficiency, which in turn affects production efficiency and costs. After plasma cleaning, the wettability of both water and underfill adhesive on the ceramic substrate surface is improved.

Jan. 04, 2026

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