Plasma Asher
Home / Products / Plasma Asher
Plasma Asher

Plasma Asher

Plasma ashing is the process of removing photoresist from etched wafers. The ashing process uses fluorine or oxygen. Our Plasma Asher series provides high-efficiency, solvent-free photoresist removal and surface treatment solutions tailored for the microelectronics, MEMS, display, and laboratory sectors. Built with precision RF plasma technology, these systems are ideal for both production lines and R&D labs seeking clean, uniform, and damage-free ashing.


Applications of Plasma Ashers


Ashing of semiconductor photoresists, peeling of polyimides, etching, cleaning and decontamination of wafers, hydrophilic surface modification, etc.


Technical Highlights 


Ash rate: Up to 10 μm/min (photoresist) depending on gas & power    


Plasma sources: RF (13.56 MHz) or microwave-driven options    


Temperature range: Room temperature to 250°C (depending on system design)    


Chamber sizes: Accommodate 2"–12" wafers or custom substrates    


Process gases: O₂, CF₄, Ar, N₂, with mass flow control    


Industry segmentation of Plasma Ashers


Research, R&D, University, Academic, Medical Devices, MEMS, Photonics, Photovoltaics, Semiconductors, Printed Electronics, etc.


NaenTech Plasma Ashers Quick guide 


NE-PE13F Desktop Plasma Asher: entry level plasma treatment system


NE-Q15HICP Vertical Plasma Asher: wafer stripping or mask removal


NE-PE13FHRF Plasma Asher Machine: processing wafers and silicon wafers for degumming


NE-MW10 Microwave Plasma Asher Equipment: batch wafer degumming and removal of residual glue


NE-RE08 RIE Plasma Asher: photoresist removal and ashing processes of wafers with a diameter of 8 inches or less


Why Choose Naen?


Over 15 years of industry expertise in plasma surface engineering


Modular & scalable designs for R&D and mass production


CE and ISO9001 certified systems with global support


Process development support from our in-house plasma lab


Explore our full range of Plasma Asher systems designed for today's precision cleaning and etching challenges. Whether your goal is to reduce chemical usage, improve uniformity, or meet stricter yield demands, Naen offers a future-ready solution.


Contact Us


VIEW MORE

Contact
  • +86 173 0440 3275
  • luwanjun@naentech.cn
  • Huaming City, Guangming District, Shenzhen, Guangdong, China
Custom Plasma Equipment

Copyright@ NAEN Technology Co., Ltd. All Rights Reserved.| Sitemap | Powered by Reanod