Plasma Asher
Plasma ashing is the process of removing photoresist from etched wafers. The ashing process uses fluorine or oxygen. Our Plasma Asher series provides high-efficiency, solvent-free photoresist removal and surface treatment solutions tailored for the microelectronics, MEMS, display, and laboratory sectors. Built with precision RF plasma technology, these systems are ideal for both production lines and R&D labs seeking clean, uniform, and damage-free ashing.
Ashing of semiconductor photoresists, peeling of polyimides, etching, cleaning and decontamination of wafers, hydrophilic surface modification, etc.
Ash rate: Up to 10 μm/min (photoresist) depending on gas & power
Plasma sources: RF (13.56 MHz) or microwave-driven options
Temperature range: Room temperature to 250°C (depending on system design)
Chamber sizes: Accommodate 2"–12" wafers or custom substrates
Process gases: O₂, CF₄, Ar, N₂, with mass flow control
Research, R&D, University, Academic, Medical Devices, MEMS, Photonics, Photovoltaics, Semiconductors, Printed Electronics, etc.
NE-PE13F Desktop Plasma Asher: entry level plasma treatment system
NE-Q15HICP Vertical Plasma Asher: wafer stripping or mask removal
NE-PE13FHRF Plasma Asher Machine: processing wafers and silicon wafers for degumming
NE-MW10 Microwave Plasma Asher Equipment: batch wafer degumming and removal of residual glue
NE-RE08 RIE Plasma Asher: photoresist removal and ashing processes of wafers with a diameter of 8 inches or less
Over 15 years of industry expertise in plasma surface engineering
Modular & scalable designs for R&D and mass production
CE and ISO9001 certified systems with global support
Process development support from our in-house plasma lab
Explore our full range of Plasma Asher systems designed for today's precision cleaning and etching challenges. Whether your goal is to reduce chemical usage, improve uniformity, or meet stricter yield demands, Naen offers a future-ready solution.
VIEW MORE
Plasma
Copyright@ NAEN Technology Co., Ltd. All Rights Reserved.|
Sitemap
| Powered by